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Heat Sink
Tungsten Copper Heat Sink Tungsten Copper Heat Sink’s properties Applications of Copper Tungsten Heat Sink Copper Molybdenum Heat Sink Properties of Copper Molybdenum Heat Sink ![]() ![]() This is a mini-website professionally introducing heat sink offered by Chinatungsten Online. .....
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Tungsten Copper Heat Sink’s properties Copper Tungsten is one of the most popular refractory metal based heat sink materials offered today. With the new off-the-shelf system, we are able to offer standard products with a short lead-time at extremely competitive rates. Traditional CPU heat sink designs usually feature a metal heat sink and a fan working in concert to siphon off the heat generated by computer parts. However, that design creates a 'boundary layer' of air, retaining the heat that the fan is supposed to disperse. The power necessary to drive the fan, as well as the fan's proximity to the boundary layer, makes that design inefficient. The Sandia Cooler eliminates the fan, replacing it with a finned heat sink that can disperse the boundary layer far more efficiently since the two are in closer contact. Tungsten copper is the best material to make the high performance and best quality Heat Sink. To understand how heat sink work, think of heat energy itself as behaving very much like an electrical current, and temperature rise as the thermal equivalent of voltage drop. We also have to introduce a property of materials and objects known as thermal resistance, which behaves in a very similar way to electrical resistance: the more heat energy ‘flowing’ through it, the higher the temperature rise across it. The combination of tungsten & copper materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates. Because of tungsten copper's thermal conductivity and expansion characteristics, Tungsten copper alloy works well in densely packed circuits. The combination of these two materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates. Because of its thermal conductivity and expansion characteristics, it works well in densely packed circuits. W-Cu heat sink material is a composite of tungsten and copper. W-Cu material with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can adjust the W-Cu composition and to design (with professional terms, tungsten and copper in the performance can be cut), and thus the application to the tungsten and copper brought great convenience. The produced tungsten copper alloy is with the good thermal expansion match with the following material: So if you have any interest in this product, please feel free to email us: sales@chinatungsten.com or call us by: 0086 592 512 9696, 0086 592 512 9595.
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